May 8, 2012, to promote the use of TSV (TSV) is a new generation of three-dimensional multi-layer DRAM "Hybrid Memory Cube (HMC)" universal Hybrid Memory Cube Consortium (HMCC) announced that the US software giant Microsoft has joined the Association .

HMC is a three-dimensional structure is superimposed on a plurality of DRAM chips in the logic chip in the vertical direction, and connection wiring technique by TSV. HMC's biggest feature is compared with the existing DRAM, performance can be greatly improved. There are two reasons ascension, first wiring distance between the chips on the motherboard traditional methods can be amortized from the semiconductor package "cm" unit significantly reduced to tens of μm ~ 1mm; the second is on a chip can be formed from 1000 to count ten thousand TSV, multi-point connections between chips.

The reason why Microsoft joined HMCC, because considering how correspond likely to become PC and computer performance improvement "memory bottleneck" problem. Memory bottleneck refers to as multi-core microprocessor performance through continuous improvement, DRAM performance of existing infrastructure will not be able to meet the needs of the processor. If you do not solve this problem occurs even if you purchased your computer new products, actual performance is not improved accordingly situation. In contrast, if applied to the main memory of a computer-based TSV of HMC, data transmission speed can be increased to about 15 times the current DRAM, therefore, not just Microsoft, microprocessor giant Intel and other companies are also actively studying using HMC.

In fact, plans to use not just the HMC and other TSV DRAM products. According to semiconductor manufacturers plan in the next few years, from electronic devices bear the CMOS sensor to the input function is responsible for operation of the FPGA and multi-core processors, as well as in charge of the product stored in DRAM and NAND flash memory will have been imported TSV. If you plan on schedule, TSV will assume the main function of the input, computing, storage, and other electronic devices.